Brief description of the pilot (objectives, main activities)

Pilot plant based on innovative technology to separate the epoxy resin contained in PCBs without metal losses.

Results achieved (e.g., environmental impact, community benefits)

• Validation of the innovative process design to separate the epoxy resin contained in PCBs without metal losses.

• Recovery of metal concentrate to be recycled in secondary/mixed smelters.

• Recovery of precious metals to be recycled by precious metal refineries.

• Recovery of epoxy concentrate for chemical recycling.

Key technical results (e.g. technologies used, innovations introduced)

Taltech developed innovative technologies to separate the epoxy resin contained in Printed Circuit Boards (PCBs) without losses of non-ferrous metals such as copper, gold, silver, or tin. 

During the piloting test, several promising density-based separation methods were integrated into the plant process flow, resulting in the development of two innovative solutions that were subsequently patented.